Multichip Module Package for SiC Pressure Sensors
Subject: Multichip Module Package for SiC Pressure SensorsSolicitation Number: 80NSSC26936730QNotice Type: SOLICITNAICS: 334419Notice Published: 06-26-26Response Due: 06-30-26Agency: National Aeronautics and Space AdministrationOffice: NATIONAL AERONAUTICS AND SPACE ADMINISTRATIONContact: Shanna Patterson This email address is being protected from spambots. You need JavaScript enabled to view it.Office Address: STENNIS SPACE CENTER, MS 39529Place of Performance: Cleveland, OH 44135
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