Multichip Module Package for SiC Pressure Sensors


Subject: Multichip Module Package for SiC Pressure Sensors
Solicitation Number: 80NSSC26936730Q
Notice Type: SOLICIT
NAICS: 334419
Notice Published: 06-26-26
Response Due: 06-30-26

Agency: National Aeronautics and Space Administration
Office: NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Contact: Shanna Patterson This email address is being protected from spambots. You need JavaScript enabled to view it.
Office Address: STENNIS SPACE CENTER, MS 39529
Place of Performance: Cleveland, OH 44135


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** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors